News
Renshin’s AMD 5 Billion Bond Issue Fully Subscribed in a Matter of Days
The placement of the latest bond series issued by Renshin, a leading urban development and investment company, has successfully concluded. Valued at AMD 5 billion, the entire volume was fully absorbed by the market in just a few days, driven by exceptionally high demand, despite the official placement deadline being set for February 2, 2027. Ameriabank acted as the underwriter for this issuance.
Renshin Launches Placement of a New Bond Tranche
Renshin announces the issuance of its next tranche of bonds, offering investors an opportunity to become part of the company’s long-term vision for Yerevan’s urban development. The new issuance comprises 50,000 bonds with a total value of AMD 5 billion. The placement is arranged by Ameriabank.